Technical Briefs and Posters Committee

Technical Briefs and Posters Chair

Diego Gutierrez
University of Zaragoza
Spain

 

Technical Briefs and Posters Co-Chair

Hui Huang
Shenzhen University
China

 

Technical Briefs and Posters Committee

Bedrich Benes
Purdue University
USA

Amit Bermano
Princeton University
USA

Nicolas Bonneel
University of Lyon
France

Adrien Bousseau
INRIA Sophia-Antipolis
France

Alexis Casas
On Animation Studios
Canada

Yiorgos Chrysanthou
University of Cyprus
Cyprus

Hung-Kuo Chu
National Tsing Hua University
Taiwan

Carsten Dachsbacher
Karlsruhe Institute of Technology
Germany

Bailin Deng
Cardiff University
UK

Piotr Didyk
Saarland University
Germany

Hongbo Fu
City University of Hong Kong
Hong Kong

Yotam Gingold
George Mason University
USA

Michael Goesele
Technische Universität Darmstadt
Germany

Minglun Gong
Memorial University of Newfoundland
Canada

Pheng-Ann Heng
The Chinese University of Hong Kong
Hong Kong

Ruizhen Hu
Shenzhen University
China

Alec Jacobson
University of Toronto
Canada

Adrian Jarabo
University of Zaragoza
Spain

Tao Ju
University of Washington in St. Louis
USA

Min. H Kim
Korea Advanced Institute of Science and Technology (KAIST)
South Korea

Tong-Yee Lee
National Cheng-Kung University
Taiwan

Guiqing Li
South China University of Technology
China

Yebin Liu
Tsinghua University
Taiwan

Belen Masia
University of Zaragoza
Spain

Koki Nagano
University of Southern California
USA

Andy Nealen
NYA Tandon School of Engineering
USA

Boris Neubert
Karlsruhe Institute of Technology
Germany

Jun Yong Noh
Korea Advanced Institute of Science and Technology (KAIST)
South Korea

Victor Ostromoukhov
University of Lyon
France

Matthew O’Toole
Stanford University
USA

Tobias Ritschel
University College London
UK

Manolis Savva
Princeton University
USA

Brian Summa
Tulane University
USA

Kaylan Sunkavalli
Adobe
USA

Oliver van Kaick
Carleton University
Canada

Peter Vangorp
Edge Hill University
UK

Rui Wang
State Key Lab, Zhejiang University
China

Li-Yi Wei
University of Hong Kong
Hong Kong

Tien-Tsin Wong
The Chinese University of Hong Kong
Hong Kong

Chris Wyman
NVIDIA
USA

Kun Xu
Tsinghua University
China

Pengfei Xu
Shenzhen University
China

Sai Kit Yeung
Singapore University of Technology and Design
Singapore

Lap-Fai (Craig) Yu
University of Massachusetts Boston
USA

YuShuen Wang
National Chiao-Tung University
Taiwan

Jianmin Zheng
Nanyang Technological University
Singapore